By Doi, Toshiro; Marinescu, Ioan D.; Kurokawa, Syuhei(eds.)
CMP and sharpening are the main detailed procedures used to complete the surfaces of mechanical and digital or semiconductor parts. This e-book offers the newest advancements and technological concepts within the box, making state of the art R&D obtainable to the broader engineering group. lots of the functions of those techniques are stored as private as attainable (proprietary information), and particular info will not be noticeable in specialist or technical journals and magazines. This ebook makes those techniques and functions available to a much broader commercial and educational viewers. construction at the basics of tribology, the technology of friction, put on and lubrication, the authors discover the sensible functions of CMP and sprucing throughout quite a few industry sectors. as a result of excessive speed of improvement of the electronics and semiconductors undefined, some of the awarded techniques and functions come from those industries.
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Extra info for Advances in CMP/Polishing Technologies for the Manufacture of Electronic Devices
14 was taken from a model at the German Museum, Munich and is based on archaeological findings. Lapping was used for polishing and finishing optical lenses in the late sixteenth century, such as were used in Galileo’s telescope. With the emergence of precision optical instruments in the late nineteenth century, such as binoculars and range finders, powered lapping machines were used extensively in optical shops throughout Europe and the USA. Since there was no significant requirement for producing quantities of metallic components with excellent finishes and tolerances, lapping was not used in the metal working industry.
O is the center of the rotation and the speed of rotation is N rpm. • Revolution of a work holder around an axis of a lap. The speed of revolution is n rpm. • Rotation of the work holder around the axis of the holder itself. The speed of rotation is N0 rpm. Anticlockwise rotation and revolution is taken as positive. 21. A revolution in this context means that if the work holder on a circle O whose radius is r, without changing its relative position in reference to XOY coordinates, which are fixed in space.
Shigemitsu showed that Q is not significantly affected by using coarser abrasives. This theory is supported by experiments conducted by Dr. Matsunaga. The other theory states that the stock removal rate increases significantly with an increase in abrasive grain size. Dr. Sato showed that the stock removal rate decreased greatly with decreasing grain size. Dr. Matsunaga obtained some interesting results when he conducted the lapping process by feeding the compound continuously. The abrasive used was white alumina, the vehicle used was grease, the abrasive to grease ratio used was 1:1 and a pressure of 2 kg/cm2 was applied.